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Volumn 22, Issue 2, 2005, Pages 133-144
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Thermal properties of cured bisphenol-C-epoxy resins
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Author keywords
Epoxy and phenolic resins; Hardeners and thermal analysis
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Indexed keywords
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EID: 28344436053
PISSN: 09738622
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (32)
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