Integration and reliability of a noble TiZr/TiZrN alloy barrier for Cu/low-k interconnects

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 138-140

  Suh, Bong Seok ^a   Choi, Seung Man ^a   Wee, Youngjin ^a   Lee, Jung Eun ^a   Lee, Junho ^b   Lee, Sun Jung ^a   Lee, Soo Geun ^a   Shin, Hongjae ^a   Lee, Nae In ^a   Kang, Ho Kyu ^a   Suh, Kwangpyuk ^a  

^a SAMSUNG Electronics   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DIFFUSION; LARGE SCALE SYSTEMS; POTASSIUM; RELIABILITY;

CONTACT RESISTANCE; DIFFUSION BARRIER; METAL WIRING INTEGRATION;

TITANIUM ALLOYS;

EID: 28244473018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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4. K. Higashi, et. al., IITC 2004, p6-8.
5. K. Abe, et. al., IRPS 2000, p333-338.
6. T. Tonegawa, et. al., IITC 2003, p216-218.