Smart chip, system and data center enabled by advanced flexible cooling resources

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 78-85

  Patel, Chandrakant D ^a   Bash, Cullen E ^a   Sharma, Ratnesh ^a   Beitelmal, Abdlmonem ^a   Malone, Christopher G ^b  

^a HEWLETT PACKARD LABORATORIES   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

Author keywords

Chip; Control; Data center; Energy; Energy efficiency; Essergy; Exergy; Smart data center; Sustainability; System

Indexed keywords

CHIP; DATA CENTER; ENERGY; ESSERGY; SMART DATA CENTER; SYSTEM;

CURRENT DENSITY; ENERGY EFFICIENCY; EXERGY; FLEXIBLE MANUFACTURING SYSTEMS; HEAT LOSSES; MICROPROCESSOR CHIPS;

COOLING SYSTEMS;

EID: 28144454593     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Patel, C.D., Sharma, R.K, Bash, C.E., Beitelmal, A, "Thermal Considerations in Cooling Large Scale High Compute Density Data Centers," May 2002, ITherm 2002 - Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems" San Diego, California
2. Lawrence Berkeley National Laboratories, "Data Center Case Studies" http://datacenters.lbl.gov/CaseStudies.html
3. Iyer, S., Luo, A., Mayo, R., and Ranganathan, P., May 2003, "Energy-Adaptive Display System Design for Future Mobile Environments". Proceedings of the First International Conference on Mobile Systems, Applications, and Services
4. Patel, C.D., April 2000, "Enabling Pumped Liquid Loop Cooling: Justification and the Key Technology and Cost Barriers", International Conference and Exhibition on High Density and Systems Packaging, Denver, pp 145-152
5. Sharma, R., Bash, C.E, Patel, C.D, Friedrich, R.S, Chase, J, "Balance of Power: Dynamic Thermal Management for Internet Data Centers", IEEE Internet Computing Jan/Feb 2005
6. Bash, C.E, Patel, C.D, Sharma. R.K, "InkJet Assisted Spray Cooling of Electronics", 2003, IPACK2003-35058, Proceedings of IPACK03- International Electronics Packaging Technical Conference and Exhibition, Maui, Hawaii.
7. Sharma, R.K., Bash, C.E., Patel, C.D., 2004, "Experimental Investigation of Heat Transfer Characteristics of Inkjet Assisted Spray Cooling", Proceedings of HT-FED 2004: 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC
8. Bash, C.E., Patel, C.D., Sharma, R.K., 2003, "Efficient Thermal Management of Data Centers - Immediate and Long-Term Research Needs", Intl. J. Heat, Ventilating, Air-Conditioning and Refrigeration Research, Vol. 9, No. 2, pp 137-152
9. Sharma R, Bash, C.E, Patel, C.D, June 2002, "Dimensionless Parameters for Evaluation of Thermal Design and Performance of Large Scale Data Centers", AIAA-2002-3091, American Institute of Aeronautics and Astronautics Conference, St. Louis, MO
10. Shah, A. J., Carey, V. P., Bash, C. E., Patel, C. D., 2003 (submitted), "Exergy Analysis of Data Center Thermal Management Systems", IMECE 2003-42527, 2003 International Mechanical Engineering Congress and Exposition, Washington, DC.
11. Sloman, M., Network and Distributed Systems Management, 666 p., Addison Wesley, June 1994.
12. AC Propulsion, California Peak Power Demand Graph, http://www. acpropulsion.conWeh_Grid_Power/sld005.htm
13. Patel, C.D, Sharma, R, Bash, C.E, Graupner, S, June 2003, "Energy Aware GRID: Global Service Placement based on Energy Efficiency of the Cooling Infrastructure, 2003, ASME International Mechanical Engineering Conference and Exposition, Washington D.C., USA
14. Patel, C.D., Sharma, R.K, Bash, C.E., Beitelmal, A, Friedrich, R., "Smart Cooling of Data Centers", July 2003, IPACK2003-35059, Proceedings of IPACK03-International Electronics Packaging Technical Conference and Exhibit ion, Maui, Hawaii.