Modeling of residual stresses in thin films deposited by electron beam evaporation

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 665-669

  Guisbiers, G ^a   Strehle, S ^b   Wautelet, M ^a  

^a UNIVERSITY OF MONS   (Belgium)

^b IFW DRESDEN   (Germany)

Author keywords

Evaporation process; Intrinsic; Modeling; Residual stress; Thermal

Indexed keywords

ELECTRODEPOSITION; ELECTRON BEAMS; EVAPORATION; MOLYBDENUM; SILICA; TANTALUM; THIN FILMS;

ELECTRON BEAM EVAPORATION; EVAPORATION PROCESS; INTRINSIC;

RESIDUAL STRESSES;

EID: 28044473198     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.075     Document Type: Conference Paper

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7. Availble from: < http://www.open-engineering.com >.