Aluminum pastes (lead-free/low-bow) for thin wafers

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2005, Pages 1100-1102

  Kim, S ^a   Sridharan, S ^b   Khadilkar, C ^b   Shaikh, A ^a  

^a Ferro Corporation   (United States)

^b Ferro Corporation   (United States)

Author keywords

Aluminum; Lead free; Low bow; Paste

Indexed keywords

LOAD-FREE; LOW-BOW; PASTE;

ALUMINUM; COSTS; GLASS; POLYCRYSTALLINE MATERIALS; SOLAR CELLS;

SILICON WAFERS;

EID: 27944495304     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. P. LoIgen, et. al. Aluminum Back-surface field doping profiles with surface recombination velocities below 200 cm/s, 0-7803-1220-1/93, 1993 IEEE, p236