Trends, demands and challenges in TCAD

Materials Science and Engineering: B

Volumn 124-125, Issue SUPPL., 2005, Pages 81-85

  Bork, Ingo ^a   Moroz, Victor ^a   Bomholt, Lars ^a   Pramanik, Dipu ^a  

^a SYNOPSYS INC   (United States)

Author keywords

ACP; Semiconductor technology; TCAD

Indexed keywords

LIFE CYCLE; OPTIMIZATION; SEMICONDUCTOR DEVICES; STRESS ANALYSIS; TECHNOLOGY TRANSFER;

ACP; INTEGRATION PHASE; SEMICONDUCTOR TECHNOLOGY; TCAD;

COMPUTER AIDED DESIGN;

EID: 27844519671     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2005.08.093     Document Type: Article

References (5)

1. DFM Factors and Product Life Cycle Costs, GLOBAL SYSTEM IC (ASSP/ASIC) SERVICE MANAGEMENT REPORT, vol. 14, no. 2, International Business Strategies, Inc. Los Gatos, 2005.
2. Sub-100 nm Technology Development and Optimization: Integration of TCAD with Yield Management, KLA-Tencor Yield Management Seminar, Chiba, Japan, December 2004.
3. International Technology Roadmap for Semiconductors, 2003 Edition, Front End Processes, Table 71a, p. 24.
4. T. Ghani, M. Armstrong, C. Auth, M. Bost, P. Charvat, G. Glass, T. Hoffmann, K. Johnson, C. Kenyon, J. Klaus, B. McIntyre, K. Mistry, A. Murthy, J. Sandford, M. Silberstein, S. Sivakumar, P. Smith, K. Zawadzki, S. Thompson, and M. Bohr IEDM Tech. Dig. December 2003 978 980
5. F. Nouri, P. Verheyen, L. Washington, V. Moroz, I. De Wolf, M. Kawaguchi, S. Biesemans, R. Schreutelkamp, Y. Kim, M. Shen, X. Xu, R. Rooyackers, M. Jurczak, G. Eneman, K. De Meyer, L. Smith, D. Pramanik, H. Forstner, S. Thirupapuliyur, and G.S. Higashi IEDM Tech. Dig. December 2004 1055 1058