Failure analysis of adhesively bonded structures: From coupon level data to structural level predictions and verification

International Journal of Fracture

Volumn 134, Issue 3-4, 2005, Pages 231-250

  Xie, De ^a   Chung, Jaeung ^a   Waas, Anthony M ^a   Shahwan, Khaled W ^b   Schroeder, Jessica A ^c   Boeman, Raymond G ^d   Kunc, Vlastimil ^d   Klett, Lynn B ^d  

^a UNIVERSITY OF MICHIGAN   (United States)

^b CENTRO RICERCHE FIAT   (Italy)

^c GENERAL MOTORS CORPORATION   (United States)

^d OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Adhesively bonded structures; Failure analysis; Fracture toughness of adhesive; Mixed mode fracture envelope; Strain energy release rates; Virtual crack closure technique

Indexed keywords

ADHESION; BONDING; CARBON FIBER REINFORCED PLASTICS; CRACKS; FAILURE ANALYSIS; FRACTURE TESTING; FRACTURE TOUGHNESS; STEEL STRUCTURES; STIFFNESS; STRAIN RATE; STRUCTURAL ANALYSIS;

ADHESIVELY BONDED STRUCTURES; FRACTURE ENVELOPE; STRAIN ENERGY RELEASE RATES; STRUCTURAL LEVEL PREDICTIONS; STRUCTURAL LEVEL VERIFICATION; VIRTUAL CRACK CLOSURE TECHNIQUE;

FRACTURE MECHANICS;

EID: 27844470690     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-005-0646-y     Document Type: Article

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