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Volumn 96, Issue 10, 2005, Pages 1152-1157

The influence of triple junction kinetics on the evolution of polycnstalline materials during normal grain growth: New evidence from in-situ experiments using columnar Al foil

Author keywords

Grain growth; In situ experiment; Microstructure; Triple junction kinetics

Indexed keywords

ALUMINUM; BACKSCATTERING; ELECTRON DIFFRACTION; GRAIN BOUNDARIES; GRAIN GROWTH; HEATING; IN SITU PROCESSING; METAL FOIL;

EID: 27744557349     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101155     Document Type: Article
Times cited : (8)

References (16)
  • 2
    • 0004231024 scopus 로고
    • American Society for Testing Materials, Cleveland
    • J. von Neumann, in: Metal Interfaces, American Society for Testing Materials, Cleveland (1952) 108.
    • (1952) Metal Interfaces , pp. 108
    • Von Neumann, J.1
  • 5
    • 27744436131 scopus 로고    scopus 로고
    • S. Piazolo, V.G. Sursaeva, D.J. Prior: Trans Tech Publication, LTD, Switzerland-Germany-UK-USA (2004) 929
    • S. Piazolo, V.G. Sursaeva, D.J. Prior: Trans Tech Publication, LTD, Switzerland-Germany-UK-USA (2004) 929.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.