Oxidation behaviors of metallic copper particles in NO reduction mechanism of copper/activated carbons

Journal of Colloid and Interface Science

Volumn 292, Issue 2, 2005, Pages 493-497

  Park, Soo Jin ^a   Kim, Byung Joo ^a  

^a Korea Research Institute of Chemical Technology   (South Korea)

Author keywords

Activated carbon fibers; Electroplating; Metallic copper particles; NO reduction

Indexed keywords

ACTIVATED CARBON FIBERS; METALLIC COPPER PARTICLES; NO REDUCTION;

ACTIVATED CARBON; CARBON FIBERS; ELECTRODEPOSITION; REDUCTION; SYNTHESIS (CHEMICAL); TEXTURES; THERMOOXIDATION;

COPPER COMPOUNDS;

ACTIVATED CARBON; COPPER; METAL OXIDE; NITRIC OXIDE; REDUCING AGENT;

AIRBORNE PARTICLE; ARTICLE; CHEMICAL COMPOSITION; ELECTROPLATING INDUSTRY; MOLECULAR MECHANICS; OXIDATION REDUCTION REACTION; PHYSICAL CHEMISTRY; PRIORITY JOURNAL; SCAVENGING SYSTEM; SURFACE PROPERTY;

CARBON; COPPER; NITRIC OXIDE; NITROGEN; OXIDATION-REDUCTION; OXYGEN; PARTICLE SIZE; SURFACE PROPERTIES; TIME FACTORS; X-RAY DIFFRACTION;

EID: 27744537904     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2005.05.066     Document Type: Article

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