Effect of baking process conditions on surface profile of lithography for thick film resists

Weixi Jiagong Jishu/Microfabrication Technology

Volumn , Issue 3, 2005, Pages 31-35

  Tang, Xiong Gui ^a   Yao, Xin ^a   Guo, Yong Kang ^a   Du, Jing Lei ^a   Wen, Sheng Lin ^a   Liu, Bo ^a   Liu, Qian ^a   Dong, Xiao Chun ^b  

^a SICHUAN UNIVERSITY   (China)

^b INSTITUTE OF OPTICS AND ELECTRONICS   (China)

Author keywords

Hard baking; Lithography for thick film resists; Soft baking; Surface profile of lithography

Indexed keywords

EID: 27744523802     PISSN: 10038213     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)