Room-temperature grain boundary diffusion data measured from historical artifacts

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 96, Issue 10, 2005, Pages 1187-1192

  Kremer, Raymond J ^a   Dayananda, Mysore A ^a   King, Alexander H ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Copper; Diffusion; Grain boundaries; Sheffield Plate; Silver

Indexed keywords

COPPER; DIFFUSION; EXTRAPOLATION; LOW TEMPERATURE PHENOMENA; SILVER; STABILITY;

GRAIN BOUNDARY DIFFUSION; LOW-TEMPERATURE DIFFUSION; MODERN DIFFUSIVITY; SHEFFIELD PLATE;

GRAIN BOUNDARIES;

EID: 27744442667     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101160     Document Type: Article

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