A bulk-micromachined bistable relay with U-shaped thermal actuators

Journal of Microelectromechanical Systems

Volumn 14, Issue 5, 2005, Pages 1099-1109

  Qiu, Jin ^a   Lang, Jeffrey H ^b   Slocum, Alexander H ^c   Weber, Alexis C ^c  

^a Wispry Inc   (United States)

^b USA   (United States)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Bistable relay; DRIE footing; Microelectromechanical systems (MEMS) relay; Nonlinear beam analysis; Relay contact; Thermal actuator

Indexed keywords

ELECTRIC CONTACTS; ELECTRIC CURRENTS; ELECTRIC RELAYS; ELECTRIC RESISTANCE; ELECTRIC SWITCHES; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROACTUATORS; MICROMACHINING; REACTIVE ION ETCHING;

BISTABLE RELAY; CURRENT CARRYING CAPACITY; DEEP-REACTIVE ION ETCHING (DRIE); ELECTRICAL PULSES; NONLINEAR BEAM ANALYSIS; RELAY CONTACT; THERMAL ACTUATORS;

MICROELECTROMECHANICAL DEVICES;

EID: 27644561741     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.856676     Document Type: Article

References (15)

1. J. Qiu, J. Lang, and A. Slocum, "A curved-beam bistable mechanism," J. Microelectromech. Syst., vol. 13, pp. 137-147, Apr. 2004.
2. Y. Wang, Z. Li, D. McCormick, and N. Tien, "Low-voltage lateral-contact micro relays for RF applications," in MEMS '02, pp. 645-648.
3. J. Wong, J. Lang, and M. Schmidt, "An electrostatically-actuated MEMS switch for power applications," in Proc. MEMS '00, pp. 633-638.
4. M. Ruan, J. Shen, and C. Wheeler, "Latching micro magnetic relays with multistrip permalloy cantilevers," in Proc. MEMS '01, pp. 224-227.
5. J. Simon, S. Saffer, and C. Kim, "A liquid-filled microrelay with a moving mercury microdrop," J. Microelectromech. Syst., vol. 6, pp. 208-216, 1997.
6. H. Lee, C. Leung, J. Shi, and S. Chang, "Electrostatically actuated copper-blade microrelays," Sensors and Actuators A, vol. 100, pp. 105-113, 2002.
7. W. Taylor, O. Brand, and M. Allen, "Fully integrated magnetically actuated micromachined relays," J. Microelectromech. Syst., vol. 7, pp. 181-191, 1998.
8. J. Qiu, J. Lang, A. Slocum, and R. Struempler, "A high-current electrothermal bistable MEMS relay," in Proc. MEMS '03, pp. 64-67.
9. W. Chu, M. Mehregany, and R. Mullen, "Analysis of tip deflection and force of a bimetallic cantilever microactuator," J. Micromech. Microeng., no. 3, pp. 4-7, 1993.
10. C. Lott, T. McLain, J. Harb, and L. Howell, "Modeling the thermal behavior of a surface micromachined linear-displacement thermomechanical microactuator," Sens. Actuators A, Phys., vol. 101, pp. 239-250, 2002.
11. Y. Zhang, Y. Zhang, and R. B. Marcus, "Thermally actuated microprobes for a new wafer probe card," J. Microelectromech. Syst., vol. 8, no. 1, pp. 43-49, Mar. 1999.
12. A. A. Geisberger, N. Sarkar, M. Ellis, and G. D. Skidmore, "Electrothermal properties and modeling of polysilicon microthermal actuators," J. Microelectromech. Syst., vol. 12, no. 4, pp. 513-523, Aug. 2003.
13. H. Mura, N. Ishitsuka, N. Saito, H. Ohta, C. Hashimoto, and S. Ikeda, "Stress analysis of transistor structures considering the internal stress of thin films," Japanese Soc. Mechan. Eng. (A), vol. 39, no. 2, pp. 166-171, 1996.
14. K.-S. Chen, "Materials Characterization and Structural Design of Ceramic Micro Turbomachinery," Ph.D. dissertation, Department of Mechanical Engineering, Massachusetts Institute of Technology, 1998.
15. J. Qiu, "An Electrothermally-Actuated Bistable MEMS Relay for Power Applications," Ph.D. dissertation, Department of Mechanical Engineering, Massachusetts Institute of Technology, 2003.