Electroplating process of TiB2 in NaF-NaBF4 eutectic melt with titanium fluoride

Denki Kagaku

Volumn 64, Issue 2, 1996, Pages 132-137

  Yamamoto, Takafumi ^a   Takenaka, Toshihide ^a   Kawakami, Masahiko ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Cyclic Voltammetry; Electroplating; NaF NaBF4 Eutectic Melt; TiB2

Indexed keywords

EID: 27644543265     PISSN: 03669297     EISSN: None     Source Type: Journal    
DOI: 10.5796/kogyobutsurikagaku.64.132     Document Type: Article

References (9)

1. H. Wendt, K. Reuhl and V. Schwarz, Electrochemica. Acta., 37, 273 (1992).
2. D. Schlain, F. X. McCawley and G. R. Smith, Electrodeposition of Titanium Diboride Coating, Report of Investigations 8146, U.S. Bureau of Mines, Washington, (1976).
3. D. R. Flinn, F. X. McCawley, G. R. Smith and P. B. Needham. Jr, Electrodeposition of Erosion - Resistant Titanium Diboride Coating, Report of Investigations 8332, U.S. Bureau of Mines, Washington, (1979).
4. H. Wendt and S. Dermeik, J. Appl. Electrochem. 20, 438 (1990).
5. G. W. Mellors and S. Senderoff, Electrochem. Sci., 118, 220 (1971).
6. M. Makyata, K. Matasovsky and V. I. Taranenko, Electrochemica Acta, 34, 861 (1989).
7. I. Barin, F. Sauert, E. Schultze-Rhonhof and W. S. Sheng, Ihsan Barin Thermochemical Date of Pure Substances, WGBG, Wiesbaden printed in the Federal Republic of Germany, (1993).
8. J. A. Plambeck, EncyclOpedia of Electrochemistry of the Elements, 10, pp. 11-117 (1976).