Thermoplastic green machining for the fabrication of a piezoelectric ceramic/polymer composite with 2-2 connectivity

Journal of the American Ceramic Society

Volumn 88, Issue 4, 2005, Pages 1060-1063

  Koh, Young Hag ^a,b   Yoon, Chang Bun ^a   Lee, Sung Mi ^a   Kim, Hyoun Ee ^a,b  

^a Seoul National University   (South Korea)

^b AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC COMPOSITE; ELECTROMECHANICAL PROPERTIES; THERMOPLASTIC BINDERS; THERMOPLASTIC GREEN MACHINING;

BINDERS; CERAMIC MATERIALS; ELECTRIC PROPERTIES; EPOXY RESINS; HEAT TREATMENT; LEAD COMPOUNDS; PIEZOELECTRICITY; SINTERING; THERMOPLASTICS;

COMPOSITE MATERIALS;

EID: 27644525987     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00210.x     Document Type: Article

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