Development of a new electroplating process for Ni-W alloy deposits

Electrochimica Acta

Volumn 51, Issue 5, 2005, Pages 888-896

  Mizushima, Io ^a   Tang, Peter T ^a   Hansen, Hans N ^a   Somers, Marcel A J ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Complexing agent; Electrodeposition; Microstructure; Nickel tungsten; XRD patterns

Indexed keywords

AMINES; AMINO ACIDS; ELECTROLYSIS; ELECTROLYTES; ENERGY DISPERSIVE SPECTROSCOPY; NICKEL ALLOYS; TUNGSTEN ALLOYS; VOLTAGE MEASUREMENT; X RAY DIFFRACTION;

CITRATE- TRIETHANOLAMINE; COMPLEXING AGENT; NICKEL-TUNGSTEN; XRD PATTERNS;

ELECTROPLATING;

EID: 27644513340     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.04.050     Document Type: Conference Paper

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