Simulation of particle incorporation during electrodeposition process: Primary and secondary current distributions

Journal of the Electrochemical Society

Volumn 152, Issue 10, 2005, Pages

  Lee, Jaesung ^a,b   Talbot, Jan B ^a,b  

^a UNIVERSITY OF CALIFORNIA SAN DIEGO   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DISTRIBUTIONS; NONCONDUCTING PARTICLES;

CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; FILM GROWTH; FINITE ELEMENT METHOD; LAPLACE TRANSFORMS; METALLIC FILMS;

ELECTRODEPOSITION;

EID: 27644476622     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2032429     Document Type: Article

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