Using TCAD for fast analysis of misprocessed wafers and yield excursions

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2005, Pages 198-200

  Minixhofer, Rainer ^a,c   Rathei, Dieter ^b,d  

^a AMS AG   (Austria)

^b D R Yield Software and Solutions   (Austria)

^c Device R and D ^*  (Austria)

^d IEEE

Author keywords

Missing implants; Process simulation; TCAD; Wafer misprocessing; Wrong implants; Yield analysis; Yield excursions

Indexed keywords

MISSING IMPLANTS; PROCESS SIMULATION; TCAD; WAFER MISPROCESSING; WRONG IMPLANTS; YIELD ANALYSIS; YIELD EXCURSIONS;

ACCIDENTS; COMPUTER SIMULATION; PREVENTIVE MAINTENANCE;

SILICON WAFERS;

EID: 27644466935     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. R. Minixhofer, G. Roehrer, S. Selberherr, Implementation of an Automated Interface for Integration of TCAD with Semiconductor Fabrication, 14th European Simulation Symposium and Exhibition (ESS'02), Dresden, Germany 2002.