Fractography, mechanical properties, and microstructure of commercial silicon nitride-titanium nitride composites

Journal of the American Ceramic Society

Volumn 88, Issue 4, 2005, Pages 926-933

  Blugan, Gurdial ^a,b   Hadad, Mousab ^a,c   Janczak Rusch, Jolanta ^a,d   Kuebler, Jakob ^a,b   Graule, Thomas ^a,b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b Laboratory for High Performance Ceramics   (Switzerland)

^c Tribology Laboratory

^d Laboratory for Surface and Joining Technology   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; GRAINS; SI3N4; SI3N4-TIN COMPOSITES;

ELASTIC MODULI; FRACTOGRAPHY; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SILICON COMPOUNDS; THERMAL EXPANSION; TITANIUM NITRIDE; WEAR RESISTANCE;

CERAMIC MATRIX COMPOSITES;

EID: 27644433854     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00186.x     Document Type: Article

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