3D self-assembling of SU-8 microstructures on silicon by plasma induced compressive stress

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 19-22

  Bureau, Jean Baptiste ^a   Legrand, Bernard ^a   Collard, Dominique ^a,b   Buchaillot, Lionel ^a  

^a INSTITUT D ELECTRONIQUE   (France)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Compressive stress; Micro structuring; Self assemble; SU 8

Indexed keywords

BEAM STRUCTURES; PLASMA PROCESS; SELF-ASSEMBLED MICROSTRUCTURES; SU-8;

COMPRESSIVE STRESS; PHOTORESISTORS; PLASMA APPLICATIONS; SELF ASSEMBLY; THREE DIMENSIONAL COMPUTER GRAPHICS; X RAY PHOTOELECTRON SPECTROSCOPY;

MICROSTRUCTURE;

EID: 27544498889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1496348     Document Type: Conference Paper

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