Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 1322-1325

  Sudou, Minoru ^a,b   Takao, Hidekuni ^b   Sawada, Kazuaki ^b   Ishida, Makoto ^b  

^a SEIKO INSTRUMENTS INC   (Japan)

^b TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Deep Reactive Ion Etching; MEMS; Multi Chip Module; Surface Mount Devices

Indexed keywords

DEEP REACTIVE ION ETCHING; MEMS; MULTI CHIP MODULE; SURFACE MOUNT DEVICES;

AUTOMATION; DYNAMICS; GRAVITATION; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SILICON WAFERS;

SURFACE MOUNT TECHNOLOGY;

EID: 27544488867     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1497324     Document Type: Conference Paper

References (4)

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3. John R. Long and Miles A. Copeland, "The Modeling, Characterization, and Design of Monolithic Inductors for Silicon RF IC's", IEEE J. Solid-State Circuits, vol. 32, pp.357-369, March 1997.
4. Rick L. Thompson, Michael J. Degerstorm, Wayne L. Walters, Mark E. Vickberg, Paul J. Riemer, Eric L. H. Amundsen, and Barry K. Gilbert, "An 8-Bit 2-Gigasample/Second A/D Converter Multichip Module for Digital Receiver Demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft Rader", IEEE Trans. Comp., Packag., Manufact. Technol. B, vol.21, No.4, Nov., 1998