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Volumn 1, Issue , 2005, Pages 311-316
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An ultra-low-power physics package for a Chip-scale Atomic Clock
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Author keywords
Atomic clock; Low power; Polyimide suspension; Thermal isolation
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Indexed keywords
LOW-POWER PHYSICS;
MECHANICAL STABILITY;
ROOM TEMPERATURE;
THERMAL ISOLATION;
ELECTRONICS PACKAGING;
TEMPERATURE CONTROL;
THERMAL EFFECTS;
ATOMIC CLOCKS;
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EID: 27544448644
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2005.1496419 Document Type: Conference Paper |
Times cited : (59)
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References (6)
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