Effects of Ni film thickness on the structural stability of Si/Ni/Cu film electrodes

Materials Letters

Volumn 60, Issue 1, 2006, Pages 90-93

  Cho, Gyu Bong ^a   Cho, Kwon Koo ^a   Kim, Ki Won ^a  

^a Gyeongsang National University   (South Korea)

Author keywords

Li Si thin film cell; Ni film; Si Ni Cu film electrode

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; ELECTROCHEMISTRY; ELECTRODES; INTERFACIAL ENERGY; NICKEL;

LI/SI THIN FILM CELLS; NI FILMS; SI/NI/CU FILM ELECTRODES; TRIGONAL CLUSTERS;

THIN FILMS;

EID: 27544431900     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.07.078     Document Type: Article

References (8)

1. X. Yu, J.B. Bates, G.E. Jellison Jr., and F.X. Hart J. Electrochem. Soc. 144 1997 524
2. B.J. Neudecker, N.J. Dudney, and J.B. Bates J. Electrochem. Soc. 147 2000 517
3. Graetz, C.C. Ahn, R. Yazami, and B. Fults Electrochem. Solid-State Lett. 6 2003 A194
4. C.J. Wen, and R.A. Huggins J. Solid State Chem. 37 1981 271
5. H. Ikeda, M. Fijoimoto, S. Fujitani, Y. Domoto, Y. Yagi, H. Tarui, N. Tamura, R. Ohshita, N. Kamino, and I. Yonezu Proceedings of the Presentation at the 42nd Battery Symposium, Japan 2001 282 283 Abstract no. 52
6. D.A. Porter, and K.E. Easterling Phase Transformations in Metals and Alloys 1992 Chapman & Hall London 115
7. P. Sandstrom, E.B. Svedberg, J. Birch, and J.E. Sundgren J. Cryst. Growth 197 1999 849
8. S.J. Lee, J.K. Lee, S.H. Chung, H.Y. Lee, S.M. Lee, and H.K. Baik J. Power Sources 97-98 2001 191