Piezoresistive accelerometers for MCM-Package - Part II: The packaging

Journal of Microelectromechanical Systems

Volumn 14, Issue 4, 2005, Pages 806-811

  Cabruja, Enric ^a   Collado, Ana ^a   Plaza, José Antonio ^a   Esteve, Jaume ^a  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

Author keywords

Multichip modules deposited (MCM D) package; Piezoresistive accelerometers; Smart microelectromechanical systems (MEMS)

Indexed keywords

ACCELEROMETERS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTELLIGENT MATERIALS; MULTICHIP MODULES; PIEZOELECTRIC DEVICES;

MULTICHIP MODULES DEPOSITED PACKAGE; PIEZORESISTIVE ACCELEROMETERS; SMART MICROELECTROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 27144469579     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.845456     Document Type: Article

References (8)

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