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Volumn 46, Issue 23, 2005, Pages 9919-9927

Evolution of the coefficient of thermal expansion of a thermosetting polymer during cure reaction

Author keywords

Dielectric spectroscopy; Thermal expansion; Thermoset

Indexed keywords

COMPOSITE MATERIALS; DIELECTRIC DEVICES; IONIC CONDUCTION; REACTION KINETICS; RESIDUAL STRESSES; SPECTROSCOPIC ANALYSIS; THERMAL EXPANSION;

CURE REACTION; DIELECTRIC SPECTROSCOPY; REACTING THERMOSET; THERMOSETTING POLYMER;

THERMOSETS;

POLYMER SCIENCE;

EID: 26844537677 PISSN: 00323861 EISSN: None Source Type: Journal
DOI: 10.1016/j.polymer.2005.07.061 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.