Distribution of current, surface impedance, and damping in superconductor coupled microstriplines

Technical Physics

Volumn 42, Issue 2, 1997, Pages 196-201

  Vendik, I B ^a   Gubina, M N ^a   Deleniv, A N ^a   Kholodnyak, D V ^a  

^a SAINT PETERSBURG ELECTROTECHNICAL UNIVERSITY LETI   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 26644461963     PISSN: 10637842     EISSN: None     Source Type: Journal    
DOI: 10.1134/1.1258623     Document Type: Article

References (9)

1. O. Vendik and E. Kollberg, Microwave & RF 32(7), 118 (1993).
2. D. M. Sheen, S. M. Ali, D. E. Oates et al., IEEE Trans. Appl. Supercond. AS-1, 108 (1991).
3. S. M. El-Ghazaly, IEEE Microwave and Guided Letters 1, 255 (1991).
4. O. G. Vendik and A. Yu. Popov, Zh. Tekh. Fiz. 63(7), 1 (1993)
5. [Tech. Phys. 38, 535 (1993)].
6. O. Vendik, S. Gal'chenko, D. Kaparkov et al., Chalmers University of Technology. Rep. N 9 (1994), ISSN 1103-4599, ISRN CTN-MVT-R-9-SE.
7. L. Lofgren and O. Vendik, Proceedings of the Twenty-Third EuMC, Reed Exhibition Co., Madrid (1993), pp. 644-645.
8. S. Gevorgian, E. Kollberg, and O. Vendik, Proceedings of the Twenty-Fourth EuMC, Nexus Business Co., Cannes (1994), Vol. 1, pp. 505-510.
9. T. C. Edwards, Foundations for Microstrip Circuit Design, Wiley, New York (1992).