Immersion plating and its applications to printed circuit board

Jinshu Rechuli/Heat Treatment of Metals

Volumn 30, Issue SUPPL., 2005, Pages 262-265

  Wei, Zhe Liang ^a   Tang, Dian ^a   Wang, Xin ^a   You, Shao Xin ^b  

^a FUZHOU UNIVERSITY   (China)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Electrochemical deposit; Immersion plating; Printed circuit board (PCB)

Indexed keywords

EID: 26644453587     PISSN: 02546051     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (30)