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Volumn 49, Issue 4, 2001, Pages 441-455

Cure kinetics and thermal property of bisphenol-S epoxy resin and phthalic anhydride

Author keywords

Bisphenol s epoxy resin; Cure reaction kinetics; Glass transition temperature; Phthalic anhydride; Thermal degradation kinetics

Indexed keywords


EID: 26444599738     PISSN: 03678369     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (6)

References (21)
  • 3
    • 57649154300 scopus 로고
    • U.S. Pat. 2,765,322
    • Beavers, E. M. (1953). U.S. Pat. 2,765,322.
    • (1953)
    • Beavers, E.M.1
  • 4
    • 57649147443 scopus 로고
    • U.S. Pat. 2,767,157
    • Masters, J. E. (1956). U.S. Pat. 2,767,157.
    • (1956)
    • Masters, J.E.1
  • 13
    • 0004160678 scopus 로고
    • Beijing, Chemical Industry Publishing Co.
    • Liu, Z. H., Thermoanalysis Introduction, Beijing, Chemical Industry Publishing Co., 1991.
    • (1991) Thermoanalysis Introduction
    • Liu, Z.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.