Numerical simulation of electrode process in Cu/CuSO4 + H 2SO4 system

Electrochimica Acta

Volumn 49, Issue 20, 2004, Pages 3283-3292

  Pirogov, B Ya ^a   Zelinsky, A G ^a  

^a INSTITUTE OF SOLID STATE CHEMISTRY AND MECHANOCHEMISTRY   (Russian Federation)

Author keywords

Copper electrode; Copper sulphate solution; Electromigration; Numerical simulation; Passivity

Indexed keywords

COMPUTER SIMULATION; COPPER ALLOYS; CURRENT DENSITY; DIFFUSION; DISSOCIATION; ELECTROCHEMISTRY; ELECTRODES; ELECTROLYTES; ELECTROMIGRATION; HYDROGEN; MATHEMATICAL MODELS; PASSIVATION; RATE CONSTANTS;

COPPER ELECTRODES; COPPER SULFATE SOLUTION; ELECTROCHEMICAL REACTIONS; PASSIVITY;

BINARY MIXTURES;

EID: 2642568605     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2004.02.041     Document Type: Article

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