Theoretical model and experiment for the grain growth of IC interconnect materials

Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics

Volumn 23, Issue 4, 2003, Pages 526-531

  Liu, Jian ^a   Huang, Rongxu ^b   Jiang, Juxiao ^a   Zheng, Guoxiang ^a  

^a FUDAN UNIVERSITY   (China)

^b Adv Semi conduct Mfg Corp   (China)

Author keywords

Grain growth; Interconnect; Lognormal distribution; Surface energy

Indexed keywords

GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; THIN FILMS;

GRAIN SIZE DISTRIBUTION; INTERCONNECT MATERIALS; LOGNORMAL DISTRIBUTION; SURFACE ENERGY;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 2642511757     PISSN: 10003819     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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