-
2
-
-
0003880724
-
-
Advances in Chemistry series, American Chemical Society, Washington, DC
-
Hess, D.W., and K.F. Jensen, eds., Microelectronics Processing: Chemical Engineering Aspects, Advances in Chemistry series, Vol. 221, American Chemical Society, Washington, DC (1989)
-
(1989)
Microelectronics Processing: Chemical Engineering Aspects
, vol.221
-
-
Hess, D.W.1
Jensen, K.F.2
-
3
-
-
0003675605
-
-
MCGraw-Hill, New York, NY
-
Middleman, S., and A. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, MCGraw-Hill, New York, NY (1993)
-
(1993)
Process Engineering Analysis in Semiconductor Device Fabrication
-
-
Middleman, S.1
Hochberg, A.2
-
5
-
-
2642573935
-
-
Session 19, ASEE Summer School for Chemical Engineering Faculty, Snowbird, UT
-
Hess, D.W., S. Bidstrup-Allen, P. Kohl, M. Allen, and G. May, "Thermal Oxidation of Silicon: A Unit Operation for ChEs," Session 19, ASEE Summer School for Chemical Engineering Faculty, Snowbird, UT (1997)
-
(1997)
Thermal Oxidation of Silicon: A Unit Operation for ChEs
-
-
Hess, D.W.1
Bidstrup-Allen, S.2
Kohl, P.3
Allen, M.4
May, G.5
-
6
-
-
0003466921
-
-
Prentice-Hall PTR, Saddle River, NJ
-
Fogler, H. Scott, Elements of Chemical Reaction Engineering, 3rd ed., Prentice-Hall PTR, Saddle River, NJ (1999)
-
(1999)
Elements of Chemical Reaction Engineering, 3rd Ed.
-
-
Fogler, H.S.1
-
7
-
-
0003657961
-
-
John Wiley & Sons, New York, NY
-
Welty, James, Charles Wicks, Robert Wilson, and Gregory Rorrer, Fundamentals of Momentum, Heat, and Mass Transfer, 4th ed., John Wiley & Sons, New York, NY (2001)
-
(2001)
Fundamentals of Momentum, Heat, and Mass Transfer, 4th Ed.
-
-
Welty, J.1
Wicks, C.2
Wilson, R.3
Rorrer, G.4
-
8
-
-
0034263080
-
A web-based course in the fundamentals of microelectronics processing
-
Dang, S.S., R.A. Matthes, and C.G. Takoudis, "A Web-Based Course in the Fundamentals of Microelectronics Processing, Chem. Eng. Ed., 34(4), 350 (2000)
-
(2000)
Chem. Eng. Ed.
, vol.34
, Issue.4
, pp. 350
-
-
Dang, S.S.1
Matthes, R.A.2
Takoudis, C.G.3
-
9
-
-
2642538562
-
A hands-on laboratory in the fundamentals of semiconductor manufacturing
-
and references therein
-
Chang, J.P., "A Hands-On Laboratory in the Fundamentals of Semiconductor Manufacturing, Chem. Eng. Ed., 36(1), 14 and references therein (2002)
-
(2002)
Chem. Eng. Ed.
, vol.36
, Issue.1
, pp. 14
-
-
Chang, J.P.1
-
10
-
-
0000248882
-
Interdisciplinary teaching and learning in a semiconductor processing course
-
Muscat, A.J., E.L. Allen, E.D.H. Green, and L.S. Vanasupa, "Interdisciplinary Teaching and Learning in a Semiconductor Processing Course," J. Eng. Ed., 87, 413 (1998)
-
(1998)
J. Eng. Ed.
, vol.87
, pp. 413
-
-
Muscat, A.J.1
Allen, E.L.2
Green, E.D.H.3
Vanasupa, L.S.4
-
11
-
-
8744318606
-
Integration of microelectronics-based unit operations into the ChE curriculum
-
Session 1313
-
Koretsky, M.D., C.-H. Chang, S. Kimura, S. Rochefort, and C. Shaner, "Integration of Microelectronics-Based Unit Operations into the ChE Curriculum," Session 1313, Proceedings of the 2003 ASEE Annual Conference
-
Proceedings of the 2003 ASEE Annual Conference
-
-
Koretsky, M.D.1
Chang, C.-H.2
Kimura, S.3
Rochefort, S.4
Shaner, C.5
-
12
-
-
0342763557
-
Fundamentals of plasma chemistry
-
A.T. Bell and J.R. Hollahan, eds., John Wiley & Sons, New York, NY
-
Bell, A.T., "Fundamentals of Plasma Chemistry," in Techniques and Applications of Plasma Chemistry, A.T. Bell and J.R. Hollahan, eds., John Wiley & Sons, New York, NY (1974)
-
(1974)
Techniques and Applications of Plasma Chemistry
-
-
Bell, A.T.1
-
13
-
-
0022706010
-
A continuum model of DC and rf discharges
-
Graves, D., and K.F. Jensen, "A Continuum Model of DC and rf Discharges," IEEE Trans. Plasma Sci., P5-14, 78 (1986)
-
(1986)
IEEE Trans. Plasma Sci.
, vol.P5-14
, pp. 78
-
-
Graves, D.1
Jensen, K.F.2
-
14
-
-
0022027406
-
Transient behavior during film removal in diffusion-controlled plasma etching
-
Alkire, R.C., and D.J. Economou, "Transient Behavior During Film Removal in Diffusion-Controlled Plasma Etching," J. Electrochem. Soc., 132, 648 (1985)
-
(1985)
J. Electrochem. Soc.
, vol.132
, pp. 648
-
-
Alkire, R.C.1
Economou, D.J.2
-
17
-
-
0022041160
-
Chemical vapor deposition: A chemical engineering perspective
-
Hess, D.W., K.F. Jensen, and T.J. Anderson, "Chemical Vapor Deposition: A Chemical Engineering Perspective," Rev. Chem. Engg., 3, 97 (1985)
-
(1985)
Rev. Chem. Engg.
, vol.3
, pp. 97
-
-
Hess, D.W.1
Jensen, K.F.2
Anderson, T.J.3
-
18
-
-
0020822409
-
Modeling and analysis of low pressure CVD reactors
-
Jensen, K.R., and D.B. Graves, "Modeling and Analysis of Low Pressure CVD Reactors, J. Electrochem. Soc., 130, 1950 (1983)
-
(1983)
J. Electrochem. Soc.
, vol.130
, pp. 1950
-
-
Jensen, K.R.1
Graves, D.B.2
-
19
-
-
0023383614
-
Low pressure CVD of silicon nitride
-
Roenigk, K.F., and K.F. Jensen, "Low Pressure CVD of Silicon Nitride, J. Electrochem. Soc., 134(7), 1777 (1987)
-
(1987)
J. Electrochem. Soc.
, vol.134
, Issue.7
, pp. 1777
-
-
Roenigk, K.F.1
Jensen, K.F.2
-
21
-
-
0034325420
-
Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities
-
Edgar, T.F., S. Butler, W.J. Campbell, C. Pfeiffer, C. Bode, S.G. Hwang, K.S. Balakrishnan, and J. Hahn, "Automatic Control in Microelectronics Manufacturing: Practices, Challenges, and Possibilities," Automatica, 36, 1567 (2000)
-
(2000)
Automatica
, vol.36
, pp. 1567
-
-
Edgar, T.F.1
Butler, S.2
Campbell, W.J.3
Pfeiffer, C.4
Bode, C.5
Hwang, S.G.6
Balakrishnan, K.S.7
Hahn, J.8
-
22
-
-
36849135206
-
Flow of a viscous fluid on a rotating disc
-
Emslie, A.G., F.T. Bonner, and L.G. Peck, "Flow of a Viscous Fluid on a Rotating Disc," J. Appl. Phys., 29, 858 (1958)
-
(1958)
J. Appl. Phys.
, vol.29
, pp. 858
-
-
Emslie, A.G.1
Bonner, F.T.2
Peck, L.G.3
-
23
-
-
0021477334
-
A mathematical model for spin coating of polymer photoresists
-
Flack, W.W., D.S. Soong, A.T. Bell, and D.W. Hess, "A Mathematical Model for Spin Coating of Polymer Photoresists," J. Apply. Phys., 56 1199 (1984)
-
(1984)
J. Apply. Phys.
, vol.56
, pp. 1199
-
-
Flack, W.W.1
Soong, D.S.2
Bell, A.T.3
Hess, D.W.4
-
24
-
-
0000906111
-
Spin coating: One-dimensional model
-
Bornside, D.L., C.W. Macosko, and L.E. Scriven, "Spin Coating: One-Dimensional Model," J. Apply. Phys., 66, 5185 (1989)
-
(1989)
J. Apply. Phys.
, vol.66
, pp. 5185
-
-
Bornside, D.L.1
Macosko, C.W.2
Scriven, L.E.3
-
25
-
-
0024755491
-
Lubricant retention on a spinning visk
-
Strong, L., and S. Middleman, "Lubricant Retention on a Spinning Visk," AIChE J., 35(10), 1753 (1989)
-
(1989)
AIChE J.
, vol.35
, Issue.10
, pp. 1753
-
-
Strong, L.1
Middleman, S.2
-
27
-
-
0028444787
-
Tribology analysis of chemical mechanical polishing
-
Runnels, S.R., and L.M. Eyman, "Tribology Analysis of Chemical Mechanical Polishing," J. Electrochem. Soc., 141, 1698 (1994)
-
(1994)
J. Electrochem. Soc.
, vol.141
, pp. 1698
-
-
Runnels, S.R.1
Eyman, L.M.2
-
28
-
-
0032730568
-
Investigation of the kinetics of tungsten chemical mechanical polishing in lodate-based slurries
-
Stein, D.J., D.L. Hetherington, and J.L. Cecchi., "Investigation of the Kinetics of Tungsten Chemical Mechanical Polishing in lodate-Based Slurries," J. Electrochem. Soc., 146, 376 (1999)
-
(1999)
J. Electrochem. Soc.
, vol.146
, pp. 376
-
-
Stein, D.J.1
Hetherington, D.L.2
Cecchi, J.L.3
-
29
-
-
84862364537
-
-
〈http://jas2.eng.buffalo.edu/applets/〉
-
-
-
-
30
-
-
0035554797
-
Electrochemical engineering in the process laboratory course
-
Talbot, J.F., "Electrochemical Engineering in the Process Laboratory Course," Chem. Eng. Ed., 35(1), 74 (2001)
-
(2001)
Chem. Eng. Ed.
, vol.35
, Issue.1
, pp. 74
-
-
Talbot, J.F.1
-
31
-
-
0003508875
-
-
John Wiley & Sons, New York, NY
-
Steigerwald, J.M., S .P. Murarke, and R. J. Gutman, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York, NY (1997)
-
(1997)
Chemical Mechanical Planarization of Microelectronic Materials
-
-
Steigerwald, J.M.1
Murarke, S.P.2
Gutman, R.J.3
-
32
-
-
8744287473
-
Electrochemical effects of various slurries on the chemical mechanical polishing of copper-plated films
-
submitted to
-
Tsai, Tzu-Hsuan, and Shi-Chem Yen, "Electrochemical Effects of Various Slurries on the Chemical Mechanical Polishing of Copper-Plated Films," submitted to J. Electrochem. Soc.
-
J. Electrochem. Soc.
-
-
Tsai, T.-H.1
Yen, S.-C.2
-
33
-
-
0031233624
-
Electro-chemical measurements during the chemical-mechanical polishing of tungsten thin films
-
Kneer, E.A., C. Raghunath, V. Mathew, and S. Raghavan, "Electro-chemical Measurements During the Chemical-Mechanical Polishing of Tungsten Thin Films," J. Electrochem. Soc., 144, 3041 (1997)
-
(1997)
J. Electrochem. Soc.
, vol.144
, pp. 3041
-
-
Kneer, E.A.1
Raghunath, C.2
Mathew, V.3
Raghavan, S.4
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