Identification of efficient deposition conditions based on the determination of the effective thermal transport properties of Cu-C interface systems

Journal De Physique. IV : JP

Volumn 125, Issue , 2005, Pages 395-398

  Chotikaprakhan, S ^a,b   Dietzel, D ^a   Neubauer, E ^c,d   Bein, B K ^a   Pelzl, J ^a  

^a RUHR UNIVERSITY BOCHUM   (Germany)

^b KASETSART UNIVERSITY   (Thailand)

^c ARC SEIBERSDORF RESEARCH GMBH   (Austria)

^d VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; INFRARED RADIATION; MATHEMATICAL MODELS; RADIOMETRY; SUBSTRATES; THERMAL EFFECTS;

CU-C INTERFACE SYSTEMS; PHOTOTHERMAL CHARACTERIZATION; THERMAL DEPTH PROFILES; TWO-LAYER MODEL APPROXIMATIONS;

DEPOSITION;

EID: 26244451250     PISSN: 11554339     EISSN: 17647177     Source Type: Conference Proceeding    
DOI: 10.1051/jp4:2005125092     Document Type: Conference Paper

References (3)

1. E. Neubauer, G. Korb, C. Eisenmenger-Sittner, H. Bangert, S. Chotikaprakhan, D.Dietzel, A.M. Mansanares, B.K. Bein, The influence of mechanical adhesion of copper coatings on carbon surfaces on the interfacial thermal contact resistance, Thin Solid Films 433 (2003), 160-165.
2. S. Chotikaprakhan, D. Dietzel, J. Pelzl, E. Neubauer, B.K. Bein, Simulation of photothermal measurements on Cu-Carbon interface systems, Conf. Proceedings ICPPP, Rio de Janeiro, Brazil, 2004]
3. J. Bolte, J.H. Gu, B.K. Bein, Background Fluctuation Limit of IR Detection of Thermal Waves at High Temperatures, High Temp.- High Pressures 29, 567-580, 1997.