Modeling and optimization of ohmic heating of foods inside a flexible package

Journal of Food Process Engineering

Volumn 28, Issue 4, 2005, Pages 417-436

  Jun, Soojin ^a   Sastry, Sudhir ^a  

^a OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLEXIBLE POUCH MATERIALS; METAL FOIL ELECTRODES; OHMIC HEATING;

ELECTRODES; MICROGRAVITY PROCESSING; OHMIC CONTACTS; PACKAGING; SPACE SHUTTLES;

FOOD PROCESSING;

ELECTRODES; PACKAGING;

PHASEOLUS (ANGIOSPERM);

EID: 26244445392     PISSN: 01458876     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1745-4530.2005.00032.x     Document Type: Article

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