Influence of the thickness of copper films in Cu/W-Ta-N, Cu/C, and C/Cu/C layered structures on the temperature of the melting-dispersion process

Russian Journal of Physical Chemistry A

Volumn 79, Issue 9, 2005, Pages 1394-1400

  Gromov, D G ^a   Gavrilov, S A ^a   Redichev, E N ^a  

^a NATIONAL RESEARCH UNIVERSITY OF ELECTRONIC TECHNOLOGY   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS ALLOYS; APPROXIMATION THEORY; CARBON; COPPER ALLOYS; MELTING; THERMODYNAMICS; THICKNESS MEASUREMENT;

CARBON LAYERS; FILM THICKNESS; MELTING-DISPERSION; THIN COPPER FILMS;

THIN FILMS;

EID: 26244438175     PISSN: 00360244     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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