The urgency of deep sub-ambient cooling for gigascale integration

2005 International Conference on Integrated Circuit Design and Technology, ICICDT

Volumn , Issue , 2005, Pages 171-174

  Naeemi, A ^a   Joshi, Y ^b   Fedorov, A ^b   Kohl, P ^a   Meindl, J D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAKAGE CURRENTS; RELIABILITY;

BINARY SWITCHING OPERATIONS; GIGASCALE INTEGRATION; LIQUID-AIR COOLING; POWER DISSIPATIONS;

INTEGRATED CIRCUIT LAYOUT;

EID: 25844448084     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/icicdt.2005.1502623     Document Type: Conference Paper

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