Input electrical impedance as signature for nondestructive evaluation of weld quality during ultrasonic welding of plastics

NDT and E International

Volumn 39, Issue 1, 2006, Pages 13-18

  Ling, Shih Fu ^a   Luan, Jingen ^a   Li, Xiangchao ^a   Ang, Wendy Lee Yong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bonding strength; Input impedance; Nondestructive evaluation; Ultrasonic welding

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRIC IMPEDANCE; NONDESTRUCTIVE EXAMINATION; PLASTICS; TECHNOLOGICAL FORECASTING; ULTRASONIC WELDING; WAVEFORM ANALYSIS;

BONDING STRENGTH; IN-SITU MONITORING; INPUT IMPEDANCE; NONDESTRUCTIVE EVALUATION;

WELDS;

EID: 25444480738     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ndteint.2005.05.003     Document Type: Article

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