Focus groups: Impact of quality and process capability factors on the silicon wafer slicing process

International Journal of Manufacturing Technology and Management

Volumn 6, Issue 1-2, 2004, Pages 171-184

  Lin, Chin Tsai ^a   Chang, Che Wei ^a   Chen, Chie Bein ^b  

^a MING CHUAN UNIVERSITY   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

Author keywords

EWMA control chart; Focus groups; Multiple quality characteristics; Process capability; Silicon wafer manufacturing

Indexed keywords

ELECTRIC CONDUCTIVITY; KNOWLEDGE BASED SYSTEMS; PROCESS CONTROL; PRODUCTIVITY; QUALITY CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; STATISTICAL PROCESS CONTROL;

CONTROL CHART; EXPONENTIAL WEIGHTED MOVING AVERAGE (EWMA); FOCUS GROUPS; MULTIPLE QUALITY CHARACTERISTICS; PROCESS CAPABILITY; SILICON WAFER MANUFACTURING;

SILICON WAFERS;

EID: 2542607580     PISSN: 13682148     EISSN: None     Source Type: Journal    
DOI: 10.1504/ijmtm.2004.004513     Document Type: Article

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