MD simulations of the collision between a copper ion and a polyethylene surface: An application to the plasma-insulating material interaction

Polymer

Volumn 45, Issue 13, 2004, Pages 4565-4575

  Duffour, E ^a   Malfreyt, P ^a  

^a CNRS   (France)

Author keywords

Ablation; Collision; Molecular dynamics simulation

Indexed keywords

COMPUTER SIMULATION; COPPER; HYDROGEN; INSULATING MATERIALS; MOLECULAR DYNAMICS; SURFACE TREATMENT; THERMAL EFFECTS;

COLLISION; SURFACE DAMAGE;

POLYETHYLENES;

CARBON; COPPER ION; HYDROGEN; POLYETHYLENE;

ARTICLE; CHEMICAL BOND; CHEMICAL STRUCTURE; CRYSTAL STRUCTURE; ENERGY; MATHEMATICAL COMPUTING; MOLECULAR DYNAMICS; PHYSICAL PHENOMENA; PLASMA; SIMULATION; TEMPERATURE; VELOCITY;

POLYMER SCIENCE;

EID: 2542472491     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2004.04.014     Document Type: Article

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