The current distribution in through-hole electrodeposition. II. Tertiary current distribution

Chemical Engineering Communications

Volumn 191, Issue 7, 2004, Pages 881-908

  Chan, Steven H ^a   Cheh, Huk Y ^a  

^a Columbia University ^*  (United States)

Author keywords

Copper deposition; Tertiary current distribution; Through hole electrodeposition

Indexed keywords

COMPUTATIONAL METHODS; COPPER; COPPER COMPOUNDS; ELECTRIC CURRENT DISTRIBUTION; SURFACE PROPERTIES;

COPPER SULFATE; THROUGH-HOLE ELECTRODEPOSITION;

ELECTRODEPOSITION;

CURRENT; ELECTRODEPOSITION; FLUID FLOW; MASS TRANSFER;

EID: 2542460459     PISSN: 00986445     EISSN: None     Source Type: Journal    
DOI: 10.1080/00986440490276029     Document Type: Article

References (14)

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