Characterizing the spatial uniformity of thin-film stress, modulus, and strength via novel experimental techniques

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 904-909

  Engelstad, R L ^a   Lovell, E G ^a   Chalekian, A J ^a   Cash, M F ^a   Eguchi, H ^b  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

^b TOPPAN PRINTING CO LTD   (Japan)

Author keywords

Membrane resonance tool; Pressure bulge tool; Thin film fracture strength; Thin film material properties; Thin film stress

Indexed keywords

ELECTROSTATICS; MATHEMATICAL MODELS; NANOTECHNOLOGY; OPTIMIZATION; RESONANCE; SEMICONDUCTOR MATERIALS; STRESSES; VACUUM;

PRESSURE BULGE TOOL; RESONANT FREQUENCY; THIN FILM FRACTURE STRENGTH; VACUUM PUMPING;

THIN FILMS;

EID: 2542441041     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00241-2     Document Type: Conference Paper

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