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Volumn , Issue , 1999, Pages 26-29

Multilevel finite difference methods for the characterization of substrate coupling in deep sub-micron designs

Author keywords

[No Author keywords available]

Indexed keywords

FINITE DIFFERENCE METHOD; SYSTEMS ANALYSIS;

EID: 2542435663     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SBCCI.1999.802961     Document Type: Conference Paper
Times cited : (2)

References (13)
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    • (1995) Modeling and Analysis of Substrate Coupling in Integrated Circuits
    • Gharpurey, R.1
  • 4
    • 0005837504 scopus 로고    scopus 로고
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    • Mitra, S.1    Rutenbar, R.A.2    Carley, L.R.3    Allstot, D.J.4
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    • Addressing substrate coupling in mixedmode IC's: Simulation and power distribution systems
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    • (1994) IEEE JSSC , vol.29 , Issue.3 , pp. 226-237
    • Stanisic, B.1    Verghese, N.K.2    Rutenbar, R.A.3    Richard Carley, L.4    Allstot, D.J.5
  • 7
    • 0029214077 scopus 로고
    • Mixed-signal switching noise analysis using voronoi-tesselation substrate macromodels
    • San Francisco, CA, June
    • Ivan L. Wemple and Andrew T. Yang. Mixed-signal switching noise analysis using voronoi-tesselation substrate macromodels. In 32nd ACM/IEEE DAC, pp. 439-444, San Francisco, CA, June 1995.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.