Chemorheological studies on a dicyanate resin modified with polyethersulfone

Polymer International

Volumn 53, Issue 6, 2004, Pages 640-645

  Hong, Bong Taek ^a   Roh, Seung Sang ^a   Kim, Dae Su ^a  

^a Chungbuk National University   (South Korea)

Author keywords

Chemorheology; Dicyanate; Dielectric property; Polyethersulfone; Viscosity

Indexed keywords

CATALYSIS; CHEMICAL MODIFICATION; CURING; DIELECTRIC PROPERTIES; ISOTHERMS; REGRESSION ANALYSIS; RHEOLOGY; RHEOMETERS; VISCOSITY;

CURING BEHAVIOR; DIELECTRIC ANALYZER; ISOTHERMAL CURING TEMPERATURE;

RESINS;

MEASUREMENT METHOD; POLYETHER SULFONE; RESIN; RHEOLOGY; RHEOMETER;

EID: 2542434926     PISSN: 09598103     EISSN: None     Source Type: Journal    
DOI: 10.1002/pi.1320     Document Type: Article

References (25)

1. Osei Owusu A, Martin GC and Gotro JT, Analysis of the curing behavior of cyanate ester resin systems, Polym Eng Sci 31:1604-1609 (1991).
2. Shimp DA, Christenson JR and Ising SJ, Arocy Cyanate-Ester Resins, Rhone-Poulenc Rorer Inc., Paris (1991).
3. Gupta AM and Macosko CW, Characterization and modeling of rigid branched polycyanates, Macromolecules 26:2455-2463 (1993).
4. Zeng SY, Ann KJ, Sereris JS, Kenny JM and Nicolais L, Cure kinetics of dicyanate matrix polymers, Polym Compos 13:191-196 (1992).
5. g polycyanate material, J Appl Polym Sci 47:461-485 (1993).
6. Mehrkam P and Cochran R, Evaluation of materials for composite repair applications, Proc Tech Conf Am Soc Compos 9:389-398 (1992).
7. Woo EM, Chean CS, Kuo JF and Seferis JC, Model with experimental evidences for the morphology of binary blends of a thermosetting polycyanates with thermoplastics, Macromolecules 27:5291-5296 (1994).
8. Chang JY and Hong JL, Polycyanurates modified with hydroxyl-terminated or cyanated polyethersulfone, Polymer 42:1525-1532 (2001).
9. Pichaud S. Duteurtre X, Fit A, Stephan F, Maazouz A and Pascault JP, Chemorheological and dielectric study of epoxyamine for processing control, Polym Int 48:1205-1218 (1999).
10. Kim DS and Macosko CW, Reaction kinetics and chemorheology of a highly reactive PU system, Kor Polym J 4:54-60 (1996).
11. Kim DS and Kim SC, Rubber modified epoxy resin. I: Cure kinetics and chemorheology, Polym Eng Sci 34:625-631 (1994).
12. Kim DS and Hong BT, The cure behavior and thermal properties of dicyanate resin, Polymer (Korea) 21:252-261 (1997).
13. Macosko CW, Fundamentals of Reaction Injection Molding, Hanser Publishers, Munich, Germany (1989).
14. Moller MB, Rheology of curing: A review, Polym Eng Sci 26:432-440 (1986).
15. Chen YT and Macosko CW, Kinetics and rheology characterization during curing of dicyanates, J Appl Polym Sci 62:567-576 (1996).
16. Lee BK and Kim SC, Morphology and properties of semi-IPNs of polyetherimide and bisphenol A dicyanate, Polym Adv Technol 6:402-412 (1995).
17. Gupta AM and Macosko CW, Characterization and modeling of rigid branched polycyanates, Macromolecules 26:2455-2463 (1993).
18. Dutta A and Ryan ME, Effect of fillers on kinetics of epoxy cure, J Appl Polym Sci 24:635-639 (1979).
19. Moroni A, Mijovic J, Pearce EM and Foun CC, Cure kinetics of epoxy resins and aromatic diamines, J Appl Polym Sci 32:3761-3773 (1986).
20. Rho SS, Hong BT and Kim DS, Curing and mechanical properties of dicyanate/poly(ether sulfone) semi-interpenetrating polymer networks, J Appl Polym Sci 87:1079-1084 (2003).
21. Winter HH, Can the gel point of a cross-linking polymer be detected by the G'-G" crossover, Polym Eng Sci 27:1698-1702 (1987).
22. g epoxy system: effect of time and temperature of isothermal cure on the glass transition temperature, J Appl Polym Sci 39:909-933 (1990).
23. Pichaud S, Duteurtre X, Fit A, Stephan F, Maazouz A and Pascault JP, Chemorheological and dielectric study of epoxy-amine for processing control, Polym Int 48:1205-1218 (1999).
24. Stephan F. Fit A and Duteurtre X, In-process control of epoxy composite by microdielectrometric analysis, Polym Eng Sci 37:436-449 (1997).
25. Kim DS and Iee SK, Effect of blending polyethersulfone on the cure kinetics and physical properties of dicyanate resin, J Appl Polym Sci 82:1952-1962 (2001).