The influence of filament arrangement on current distribution and AC loss in Bi-2223/AG tapes

Superconductor Science and Technology

Volumn 17, Issue 5, 2004, Pages

  Gomory F ^a   Seiler, E ^a   Souc J ^a   Kovac P ^a   Husek I ^a   Farinon, S ^b   Fabbricatore, P ^b   Perkins, G ^c   Caplin, A D ^c   Pardo, E ^d   Sanchez, A ^d   Navau, C ^d  

^a INSTITUTE OF ELECTRICAL ENGINEERING   (Slovakia)

^b INFN SEZIONE DI GENOVA   (Italy)

^c IMPERIAL COLLEGE LONDON   (United Kingdom)

^d UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH COMPOUNDS; ELECTRIC CURRENT DISTRIBUTION; ELECTRIC CURRENTS; ELECTRIC SHIELDING; HYSTERESIS; MAGNETIC FIELD EFFECTS; MAGNETOELECTRIC EFFECTS; OPTIMIZATION; SILVER COMPOUNDS; SUPERCONDUCTING DEVICES;

AC MAGNETIC FIELD; CURRENT DISTRIBUTION; FILAMENT ARRANGEMENT; SUPERCONDUCTING ARRAYS;

MAGNETIC TAPE;

EID: 2542426701     PISSN: 09532048     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-2048/17/5/012     Document Type: Conference Paper

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