Printed glass for anodic bonding - A packaging concept for MEMS and system on a chip

Advancing Microelectronics

Volumn 29, Issue 1, 2002, Pages

  Bergstedt, Leif ^a   Persson, Katrin ^a  

^a Imego AB The Institute of Micro and Nanotechnology   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; BONDING; ELECTRONICS PACKAGING; GLASS; HERMETIC DEVICES; MICROPROCESSOR CHIPS; SILICON WAFERS; SUBSTRATES;

ANODING BONDING; HERMITIC ENCAPSULATION; INTERCONNECTION PATH; MEMS PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 25144518277     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. J. Lenkkeri, "LTCC Technology Development," The 2001 European Systems Packaging Workshop, January 22-24, Barcelona, 2001.
2. K. Kautio, "Multilayer ceramic process development," Research activities in optoelectronics and electronics manufacturing 1998, VTT Electronics.
3. Patent pending WO0129890 A, 2001-04-26, "Method relating to Anodic Bonding," L. Bergstedt, G. Andersson and B. Ottosson.
4. A. P. Malsche, C. O'Neal, S. B. Singh, W. D. Brown, W. P. Eaton and W. M. Miller, "Challenges in the Packaging of MEMS," The International Journal of Microcircuits and Electronic Packaging, Volume 22, No. 3, pp. 233-241, 1999.
5. http://www.eecs.uic.edu/~peter/ eecs449/le/Wafer_Bonding.html
6. Doctoral thesis, "Wafer Bonding - Problems and Possibilities," M. Bergh, Chalmers University of Technology, 1998.
7. G. T. Caldas, E. G. Rodrigues and R. Furlan, "Study of Anodic Bonding between Silicon and Pyrex 7740."
8. H.J. Quenzer, A.V. Schulz, T. Kinkopf and T. Helm, "Anodic Bonding on Glass Layers prepared by a Spin-On Glass Process: Preparation Process and Experimental Results," Transducers '01, The 11th International Conference on Solid-State Sensors and Actuators, Munich, Germany, June 10-14, 2001, pp. 230-233.
9. T. Rogers, "Anodic Bonding," course given by Applied Microengineering Ltd, FSRM Training in Microsystems, Didcot, England, 26th March 2001.
10. M.M. Visser, S. Weichel, P. Storås, R. de Reus and A.B. Hanneborg, "Sodium distribution in thin-film anodic bond-ing," Sensors and Actuators A 2979 (2001) 1-6.