Joining of packaging and thermal management materials using active solders

Advancing Microelectronics

Volumn 31, Issue 6, 2004, Pages 12-14

  Redd, Randall ^a   Smith, Ronald W ^a  

^a S Bond Technologies LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC MATERIALS; HARD-TO-BOND MATERIALS; OPTOELECTRONIC PACKAGING; THERMAL MANAGEMENT;

ADHESIVES; ALUMINUM; BRAZING; CARBON INORGANIC COMPOUNDS; CERAMIC MATERIALS; COMPOSITE MATERIALS; GRAPHITE; OPTOELECTRONIC DEVICES; SOLDERING ALLOYS; SURFACE TREATMENT;

ELECTRONICS PACKAGING;

EID: 25144516054     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Xien,A.P. and Z.Y.S, (1990), "Wetting of Tin Based Active Solder on Sialon Ceramic," J. of Mater. Sci. Letters, 10(22), pp. 1315-1317.
2. Economes, G. and W. Kingery, (1953), "Metal-Ceramic Interactions II: Metal Oxide Interfacial Reactions at Elevated Temperatures," J.Amer. Cer. Soc., 36, pp. 403-408.
3. Fernine,T. and A. Stugeon, (1982),"Joining Ceramic Materials," Met and Mater. Sci., 4, pp. 212-217
4. Smith, Ronald W. and R. Redd, (2004), "Active Solder Joining for Low Temperature Co-Fired Ceramics and Electronic Packages," IMAPS Ceramic Interconnect Technology Conference.