Simple and improved dielectric parameter extraction of thin organic packaging materials using open-ended coaxial line technique

IEE Proceedings: Microwaves, Antennas and Propagation

Volumn 152, Issue 4, 2005, Pages 214-220

  Lim, Y Y ^a   Rotaru, M D ^b   Alphones, A ^a   Popov, A P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PARAMETER EXTRACTION; PACKAGING SUBSTRATES; PORT MEASUREMENTS; WIDE BAND FREQUENCIES;

CORRELATION METHODS; DIELECTRIC MATERIALS; FREQUENCIES; MATHEMATICAL MODELS; PARAMETER ESTIMATION; PERMITTIVITY;

PACKAGING MATERIALS;

DIELECTRIC CONSTANT; DIELECTRICS; FREQUENCIES; MATHEMATICAL MODELS; PACKAGING MATERIALS;

EID: 25144503941     PISSN: 13502417     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ip-map:20045106     Document Type: Article

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