Development of specifications for an integrated piezoelectric wafer active sensors system

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5764, Issue , 2005, Pages 509-521

  Jenkins, Christopher ^a   Giurgiutiu, Victor ^a   Lin, Bin ^a   Liu, Weiping ^a  

^a The Department of Mechanical Engineering   (United States)

Author keywords

Cracks; Damage detection; Envelope extraction, nondestructive evaluation; Lamb waves; NDE; Piezoelectric; Piezoelectric wafer active sensor; PWAS; SHM; Structural health monitoring; Ultrasonic

Indexed keywords

DAMAGE DETECTION; ENVELOPE EXTRACTION, NONDESTRUCTIVE EVALUATION; LAMBWAVES; PIEZOELECTRIC WAFER ACTIVE SENSOR (PWAS); STRUCTURAL HEALTH MONITORING (SHM);

BOUNDARY CONDITIONS; ELECTRONIC EQUIPMENT; SENSORS;

PIEZOELECTRIC DEVICES;

EID: 25144452503     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.599877     Document Type: Conference Paper

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