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Volumn 53, Issue 11, 2005, Pages 1231-1235
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Wetting and interface phenomena in the B4C/(Cu-B-Si) system
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Author keywords
Boron carbide; Cu alloys; Interface; Joining; Wetting
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Indexed keywords
CARBON;
COPPER ALLOYS;
SILICON;
SUBSTRATES;
THERMODYNAMICS;
WETTING;
BORON CONTENT;
CARBIDE SUBSTRATES;
INTERFACE;
BORON CARBIDE;
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EID: 24944495856
PISSN: 13596462
EISSN: None
Source Type: Journal
DOI: 10.1016/j.scriptamat.2005.08.006 Document Type: Article |
Times cited : (31)
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References (8)
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