Electrical and mechanical behavior of filled rubber. III. Dynamic loading and the rate of recovery

Journal of Polymer Science, Part B: Polymer Physics

Volumn 43, Issue 13, 2005, Pages 1649-1661

  Busfield, J J C ^a   Thomas, A G ^a   Yamaguchi, K ^b  

^a QUEEN MARY UNIVERSITY OF LONDON   (United Kingdom)

^b BRIDGESTONE CORPORATION   (Japan)

Author keywords

Elastomers; Electrical resistivity; Fillers; Nanocomposites; Rubber; Swelling

Indexed keywords

DEFORMATION; DYNAMIC LOADS; ELASTOMERS; ELECTRIC CONDUCTIVITY; FILLERS; NANOSTRUCTURED MATERIALS; SOLVENTS; STRAIN; STRESS ANALYSIS; SWELLING;

CYCLIC SHEAR LOADING; DYNAMIC DEFORMATION; ROOM TEMPERATURE; TENSILE LOADING;

RUBBER;

EID: 24644510663     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/polb.20452     Document Type: Article

References (9)

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9. Pond, T. J.; Thomas, A. G. International Rubber Conference, Venice, 1979.