A miniature real-time volumetric ultrasound imaging system

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5750, Issue , 2005, Pages 26-36

  Wygant, Ira O ^a   Yeh, David T ^a   Zhuang, Xuefeng ^a   Nikoozadeh, Amin ^a   Oralkan, Orner ^a   Ergun, A Sanli ^a   Karaman, Mustafa ^b   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b ISIK UNIVERSITY   (Turkey)

Author keywords

Capacitive Micromachined Ultrasonic Transducer; CMUT; Electronics; Flip Chip Bonding; Integration; Synthetic Aperture; Systems; Through Wafer Interconnects; Two Dimensional Array; Ultrasonic Imaging

Indexed keywords

ELECTRONIC MEDICAL EQUIPMENT; ENDOSCOPY; IMAGING SYSTEMS; INTEGRATED CIRCUITS; MICROMACHINING; REAL TIME SYSTEMS; ULTRASONIC TRANSDUCERS; VOLUMETRIC ANALYSIS;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; FLIP-CHIP BONDING; SYNTHETIC APERTURE; SYSTEMS; THROUGH-WAFER INTERCONNECTS; TWO-DIMENSIONAL ARRAY;

ULTRASONIC IMAGING;

EID: 24644509288     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.596019     Document Type: Conference Paper

References (8)

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3. C. H. Cheng, A. S. Ergun, and B. T. Khuri-Yakub, "Electrical through-wafer interconnects with 0.05 pico farads parasitic capacitance on 400 ìm thick silicon substrates", in Solid-State Sensor and Actuator Work-shop, 2002, pp. 157-160.
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