Spark assisted chemical engraving (SACE) in microfactory

Journal of Micromechanics and Microengineering

Volumn 15, Issue 10, 2005, Pages

  Wuthrich R ^a   Fujisaki, K ^a   Couthy, P ^a   Hof, L A ^b   Bleuler, H ^a  

^a EPFL   (Switzerland)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; GLASS; MICROELECTROMECHANICAL DEVICES; RAPID PROTOTYPING;

MICROFLUIDIC DEVICES; SPARK ASSISTED CHEMICAL ENGRAVING (SACE); SURFACE QUALITY; TABLE-TOP TECHNOLOGY;

MICROSTRUCTURE;

EID: 24644501709     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/10/S04     Document Type: Article

References (18)

1. Wüthrich R and Fascio V 2005 Machining of non-conductive materials using electrochemical discharge phenomenon-an overview Int. J. Mach. Tools Manuf. 45 1095-108
2. Langen H, Ceausoglu I, van der Meer M, Lehmann E, Bleuler H and Renaud Ph 1997 Electrochemical micromachining of glass using micro-EDMed microtools Proc. Ultraprecision in Manufacturing Engineering (Braunsweig, 26-30 May) p 672
3. Yang C T, Ho S S and Yan B H 2001 Micro hole machining of borosilicate glass trough electrochemical discharge machining (ECDM) Key Eng. Mater. 196 149-66
4. Langen H, Fascio V, Wüthrich R and Viquerat D 2002 Three-dimensional structuring of pyrex glass devices-trajectory control Int. Conf. European Society for Precision Engineering and Nanotechnology (EUSPEN) (Eindhoven) vol 2 pp 435-8
5. Langen H, Fascio V, Wüthrich R, Ejiri T and Viquerat D 2002 Development of desktop machinery for three-dimensional microstructuring of pyrex glass devices Int. Workshop on Microfactories (Minneapolis, USA) pp 53-6
6. Lim H-J, Lim Y M, Kim S H and Kwak Y K 2001 Self-aligned micro tool and electrochemical discharge machining (ECDM) for ceramic materials Proc. SPIE 4416 348-53
7. Wüthrich R, Hof L A, Lal A, Fujisaki K, Bleuler H, Mandin Ph and Picard G Physical principles and miniaturization of spark assisted chemical engraving (SACE) J. Micromech. Microeng. 15 S268-75
8. Kurafuji H and Suda K 1968 Electrical discharge drilling of glass Ann. CIRP 16 415-9
9. Guérin L J, Dubochet O, Zeberli J F, Clot P and Renaud Ph 1998 Miniature one-shot valve Micro Electro Mechanical Systems-IEEE 11th Annual Int. Workshop Proc. pp 425-8
10. Esashi M, Matsumoto Y and Shoji S 1990 Absolute pressure sensors by air-tight electrical feedthrough structure Sensors Actuators A 21-23 1048-52
11. Daridon A, Fascio V, Lichtenberg J, Wüthrich R, Langen H, Verpoorte E and De Rooij N F 2001 Multi-layer microfluidic glass chips for microanalytical applications Fresenius J. Anal. Chem. 371 261-9
12. Lee E S, Howard D, Liang E, Collins S D and Smith R L 2004 Removable tubing interconnects for glass-based micro-fluidic systems made using ECDM J. Micromech. Microeng. 14 535-41
13. Wüthrich R and Hof L A 2005 The gas film in spark assisted chemical engraving (SACE)-a key element for micro-machining applications Int. J. Mach. Tools Manuf. submitted
14. Fascio V, Wüthrich R, Viquerat D and Langen H 1999 3D microstructuring of glass using electrochemical discharge machining (ECDM) Int. Symp. on Michromechatronics and Human Science (MHS'99) pp 179-83
15. Wüthrich R, Comninellis Ch and Bleuler H 2005 Electrochemistry under extreme current densities Electrochim. Acta at press
16. Masuzawa T, Fujino M, Kobayashi K and Suzuki T 1985 Ann. CIRP 34 431
17. Wüthrich R and Bleuler H 2004 A model for electrode effects using percolation theory Electrochim. Acta 49 1547-54
18. Wüthrich R, Fascio V and Bleuler H 2004 A stochastic model for electrode effects Electrochim. Acta 49 4005-10